Semiconductor Manufacturing | Silicon Wafer Manufacturing

World Class American-Made Power and Sensor Semiconductors

Polar is building on decades of experience in high voltage power semiconductor manufacturing with an aggressive capacity expansion and facility modernization. Let’s partner to create your differentiated products.

About Our Silicon Wafer Manufacturing Facility

Polar Semiconductor State-of-the-Art Automation

State-of-the-Art Manufacturing

Polar’s semiconductor manufacturing facilities operate with state-of-the-art equipment, automation, and production support systems to manufacture advanced BCD, MOSFET, IGBT, BiCMOS, BiPolar, MEMS, and GaN 8-inch silicon wafers for the Power and Sensor markets.

Class 1 Clean Room

With a production capacity of up to 21,000 (IC + discrete mix) wafers per month, our zero-defect-capable silicon wafer manufacturing facility meets all ISO 14644-1 cleanroom standards. In addition, 100% of Polar’s campus is powered by renewable energy.

Polar Semiconductor Robotic Wafer Transport

Fab Operation Systems

NetVision: Polar’s Manufacturing Execution System (MES) for automated planning and workflows
FabGuard: Inficon Fault Detection and Classification (FDC) tool monitoring
Robotic Wafer Transport: State-of-the-art OMRON wafer delivery robots minimize the risk of human error and contamination

Expansion and Modernization Project

With full deployment in 2027, Polar is increasing 8-inch production capacity to 40,000 (IC + discrete) or 70,000 discrete wafers per month. To enable and complement the capacity expansion, a large-scale factory automation project is under implementation. This includes Intellion LotTrack to modernize the tracking of carriers, Intellion DisTag RFID lot tracking, Muratec Overhead Transport Systems, and INFICON Intelligent Manufacturing Systems. Additionally, to support national security for Aerospace and Defense applications, Polar is implementing an ITAR compliance program, with future plans to support Trusted Programs.

Process Equipment & Tool Capabilities

Polar’s advanced semiconductor engineering utilizes cutting-edge tools to deliver high-voltage semiconductors with secure, repeatable, and cost-effective chip designs that meet all customer requirements.

Process	Capabilities
Wafer	In-house EPI: B, as doping
Implant/Diffusion	High energy (MeV) implants High temp (1250 °C) diffusion
Deposition	ALD: Atomic layer deposition (Al2O3) Sub-Atmospheric CVD (SACVD)
Lithography	130nm DUV capable with path to 90nm
Etch	Deep Trench: 60:1 Aspect ratio
Metrology	AFM: Atomic Force Microscopy
Design Enablement	PDKs & Tech Files – Rules/models for accurate design IP Libraries – Proven reusable blocks Qualified EDA Flows – Validated tools & reference flows Engineering Support – Guidelines, debugging, optimization Verification & Sign-off – DRC/LVS, extraction, timing OPC modeling – Q2 2026
Wafer Test	Parametric, wafer-level, and package reliability testing
Backside Process	250 um backgrind (50um planned) Backmetal (Ti/Ni/Au/Ag)
Analytical Services	Field Emission Scanning Electron Microscopy X-Ray Energy Dispersive Spectroscopy FIB – Focused Ion Beam STEM – Scanning Transmission Electron Microscopy PEM – Photo Emission Microscopy OBIRCH – Optical Beam Induced Resistance Change