World Class American-Made Power and Sensor Semiconductors
Polar is building on decades of experience in high voltage power semiconductor manufacturing with an aggressive capacity expansion and facility modernization. Let’s partner to create your differentiated products.
About Our Silicon Wafer Manufacturing Facility
Polar’s semiconductor manufacturing facilities operate with state-of-the-art automation and redundant production support systems to manufacture IC (BCD, BiCMOS) and Discrete (MOS, IGBT) 8-inch silicon wafers for the Power and Sensor markets. With a production capacity of up to 21,000 (IC + discrete mix) wafers per month, our silicon wafer manufacturing facility meets all ISO 14644-1 cleanroom standards. In a zero-defect capable, Class 1 clean room. In support of environmental sustainability, 100% of Polar’s campus is powered by Renewable Energy.
Advanced Semiconductor Manufacturing
Polar’s advanced semiconductor engineering utilizes cutting-edge tools to deliver high-voltage semiconductors with secure, repeatable, and cost-effective chip designs that meet all customer requirements.
- High temp diffusion
- EPI
- High AR trench
- Trench fill (SACVD)
- ALD
- CMP
- Thick metal top
- Thick nitride
- PBO
- Backgrind & backmetal
Fab Operation Systems
NetVision
Automate your planning and workflows with Polar’s homegrown Manufacturing Execution System (MES).
- Barcode WIP tracking
- Automatic recipe selection
- Real-time SPC
- Automatic shutdown
- PM scheduler
FPS
Stay on top of your equipment and tool state at all times with our intelligent WIP scheduling system.
- Setup, batching, queue timer, reticle management
- Factory dashboard and reporting
- Smart dispatching with visual cues
- Cycle time analysis
- Developed by Inficon
FabGuard
Take Fault Detection and Classification (FDC) tool monitoring and process fingerprinting to the next level.
- Independent tool control
- Process/recipe monitor
- Process shutdown
- Developed by Inficon
Robotic Wafer Transport
Minimize the risk of human error and contamination with our state-of-the-art OMRON wafer delivery robots.
- Increased efficiency
- Improved delivery and CT
- Lot tracker integration
- Minimum operator interaction
Gain Multi-Level Control Through Our Defect Reduction Program
Ongoing fab environment, equipment, process, wafer monitoring, and other improvements.
Environment level
• Paperless
• Airborne particle monitoring
• Temperature & humidity control
Machine level
• FabGuard (FDC)
• Contamination control (TXRF)
• Charge measurement (FAaST)
• Defect monitoring (SP1)
Process level
• Thickness, CD, Overlay Metrology, and SPC
Parametric level
• Screening parameters
• Critical parameters
• Outlier screening
• Zero Defect Parameters for automotive
Die level
•Altair, AIT, and TopCon particle inking for Zero Defect Program
Wafer level
• Guardband “Smart” Inking
Semiconductor Manufacturing Equipment
- ASML I-Line Steppers & DUV Scanners
- LINK-ed TEL Coat & Develop Tracks
- ASM & AMAT EPI Reactors
- AXCELIS & AMAT Implanters
- AMAT Mirra CMP KLA
- Automotive Defect Inspection
Other Installed Tools
- TEL-FSI Mercury Spray Tools
- AKRION Wet Benches
- MRL Horizontal Furnaces
- TEL Vertical Furnaces
- TEL LPCVD
- Novellus CVD
- AMAT Dry Etch
- AMAT Endura PVD
- DISCO Grind
- Eclipse Back Metal